Digital process chain for bonding

TENTA VISION and RAMPF present new solutions for digital quality assurance in bonding processes.

📅 Presentation on July 2, 2025

📍 Host: Fraunhofer IFAM & ISGATEC | Venue: ATLANTIC Hotel Universum, Wiener Str. 4, 28359 Bremen

Industrial bonding requires the highest level of process reliability and quality. Conventional testing methods quickly reach their limits, especially in series production, such as with bonded, safety-relevant components in automotive engineering. At the 23rd Bremen Bonding Days, TENTA VISION and RAMPF Production Systems will present a solution that can digitalize the entire bonding process end-to-end. This solution can ensure quality in real time without destroying the component.

Focus: Data, Sensor Technology, and Optical Adhesion Inspection

The joint technical lecture on July 2, 2025, is entitled:

"Digitalization of Industrial Dispensing Processes with Non-Destructive In-Line Adhesion Testing: Increased Efficiency, Quality, and Sustainability for Industrial Bonding Processes.”

RAMPF contributes its many years of expertise in intelligent dispensing technology and process automation. Integrated sensor technology and data analysis allow for the digital recording and automatic correction of machine reactions, material behavior, and process deviations.

TENTA VISION supplements this data-based approach with an optical, in-line adhesion inspection. Using precise thermal excitation and optical interferometry, nano-deformations of bonded components are measured — providing a direct, non-destructive indication of adhesion quality. Thus, the process detects bonding defects, such as air bubbles, delamination, and missing adhesive.

Together, RAMPF's intelligent process control and TENTA VISION's innovative inspection technology create a fully digitalized system for monitoring the bonding process.

🔗Learn more about the technology

For more information on how the technology works:

• Optical Adhesion Inspection - Principle & Application

• Optical Tomography for Series Monitoring

Presentation on July 2

The lecture will take place on July 2, 2025, as part of the Bremen Bonding Days. More information about the event is available at fraunhofer.de or ISGATEC.

For more detailed information on the lecture, technology, or specific application possibilities, contact us.

Contact us now — we will gladly provide additional content in the lead-up to the event.